Dynamic release tapes for assembly of discrete components

ABSTRACT

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

CLAIM OF PRIORITY

This application claims priority to U.S. Patent Application Ser. No.62/843,904, filed on May 6, 2019, and to U.S. Patent Application Ser.No. 62/806,154, filed on Feb. 15, 2019, the contents of both which areincorporated here by reference in their entirety.

BACKGROUND

This description relates generally to assembling discrete componentsonto a substrate.

SUMMARY

In an aspect, a method includes positioning a discrete componentassembly on a support fixture of a component transfer system, thediscrete component assembly including: a dynamic release tape including:a flexible support layer, and a dynamic release structure disposed onthe flexible support layer, and a discrete component adhered to thedynamic release tape; and irradiating the dynamic release structure torelease the discrete component from the dynamic release tape, in whichat least a portion of the flexible support layer is free-standing whenthe discrete component assembly is positioned on the support fixture.

Embodiments can have one or more of the following features.

Positioning the discrete component assembly on the support fixtureincludes mounting a wafer ring of the discrete component assembly on aframe of the support fixture.

The method includes adhering the discrete component to the dynamicrelease tape. Adhering the discrete component to the dynamic releasetape includes adhering the discrete component to a component adhesionlayer of the dynamic release structure. Adhering the discrete componentto the dynamic release tape includes transferring the discrete componentfrom a dicing tape to the dynamic release tape.

The method includes adhering a wafer to the dynamic release tape.Adhering the wafer to the dynamic release tape includes adhering thewafer to a component adhesion layer of the dynamic release structure.The method includes dicing the adhered wafer to form discretecomponents. Positioning the discrete component assembly on thetransparent support plate includes attaching the dynamic release tapeincluding the discrete components to a support plate of the supportfixture. Positioning the discrete component assembly on the supportplate includes holding the discrete component assembly on the supportplate by application of a suction.

Irradiating the dynamic release structure includes irradiating thedynamic release structure with light from a light source of thecomponent transfer system.

In an aspect, a method includes positioning a discrete componentassembly on a support fixture of a component transfer system, thediscrete component assembly including: a dynamic release tape including:a flexible support layer, and a dynamic release structure disposed onthe flexible support layer, and a discrete component adhered to thedynamic release tape; in which positioning the discrete componentassembly on the support fixture includes positioning the flexiblesupport layer of the dynamic release tape directly on a support plate ofthe support fixture; and irradiating the dynamic release structure torelease the discrete component from the dynamic release tape.

Embodiments can have one or more of the following features.

Positioning the discrete component assembly on the support fixtureincludes mounting a wafer ring of the discrete component assembly on aframe of the support fixture.

The method includes irradiating the dynamic release structure throughthe support plate to release the discrete component from the dynamicrelease tape. The method includes orienting the component transfersystem such that the discrete component is positioned between thesupport plate and a target substrate.

Positioning the discrete component assembly on a support plate includespositioning the discrete component assembly on a rigid support plate.

Positioning the discrete component assembly on the support fixtureincludes attaching the flexible support layer directly to the supportplate.

Positioning the discrete component assembly on the support plateincludes holding the discrete component assembly on the support plate byapplication of a suction.

Positioning the discrete component assembly on the support plateincludes stretching the dynamic release tape over the support plate.

The method includes adhering the discrete component to the dynamicrelease tape. Adhering the discrete component to the dynamic releasetape includes adhering the discrete component to a component adhesionlayer of the dynamic release structure. Adhering the discrete componentto the dynamic release tape includes transferring the discrete componentfrom a dicing tape to the dynamic release tape.

The method includes adhering a wafer to the dynamic release tape.Adhering the wafer to the dynamic release tape includes adhering thewafer to a component adhesion layer of the dynamic release structure.The method includes dicing the adhered wafer to form discretecomponents. Positioning the discrete component assembly on thetransparent support plate includes attaching the dynamic release tapeincluding the discrete components to a support plate of the supportfixture. Positioning the discrete component assembly on the supportplate includes holding the discrete component assembly on the supportplate by application of a suction.

Irradiating the dynamic release structure includes irradiating thedynamic release structure with light from a light source of thecomponent transfer system.

In an aspect, a discrete component transfer system includes a lightsource; a discrete component support fixture including: a support frame;a support plate positioned on the support frame, the support plate beingtransparent to light emitted by the light source; and an optical elementdisposed between the light source and the support frame.

Embodiments can have one or more of the following features.

The system includes a suction source configured to apply a suction tothe air flow channel of the discrete component support fixture to hold aflexible support layer of a discrete component assembly against thesupport plate.

The system includes a discrete component assembly including: a dynamicrelease tape including a flexible support layer, and a dynamic releasestructure disposed on the flexible support layer; and a discretecomponent adhered to the dynamic release tape; and in which the flexiblesupport layer of the dynamic release tape is positioned directly on thesupport plate and held in place by suction through an air flow channelof the discrete component support fixture. The air flow channel isformed through a thickness of the support frame. The air flow channel isformed through a thickness of the support plate.

A top surface of the support plate is misaligned from a top surface ofthe support frame by an amount sufficient to introduce a tensile stressin a dynamic release tape held on the discrete component supportfixture.

The support plate includes a glass plate.

The support plate includes a quartz plate.

The support plate is rigid.

The optical element includes a lens.

In an aspect, a discrete component transfer system includes a lightsource; a discrete component support fixture; a discrete componentassembly disposed on the discrete component support fixture, thediscrete component assembly including: a dynamic release tape includinga flexible support layer and a dynamic release structure disposed on theflexible support layer, and a discrete component adhered to the dynamicrelease tape, in which the dynamic release tape is freestanding when thediscrete component assembly is disposed on the discrete componentsupport fixture; and an optical element disposed between the lightsource and the discrete component assembly.

Embodiments can include one or more of the following features.

The discrete component assembly includes a wafer ring disposed on thediscrete component support fixture.

In an aspect, a method includes dicing a wafer adhered to a dicing tapeto form discrete components; transferring the discrete components fromthe dicing tape to a dynamic release tape to form a discrete componentassembly, including: a flexible support layer, and a dynamic releasestructure disposed on the flexible support layer; and positioning theflexible support layer of the discrete component assembly directly on asupport plate of a component transfer system.

Embodiments can include one or more of the following features.

Transferring the discrete components to the dynamic release tapeincludes adhering the discrete components to a component adhesion layerof the dynamic release structure.

The dynamic release structure of the dynamic release tape includesmultiple layers. The dynamic release structure includes an active layerstructure and a component adhesion layer, in which adhering the wafer tothe dynamic release tape includes adhering the wafer to the componentadhesion layer.

Positioning the flexible support layer directly on the support plateincludes attaching the flexible support layer directly to the supportplate.

Positioning the flexible support layer directly on the support plateincludes holding the discrete component assembly on the support plate byapplication of a suction.

Positioning the flexible support layer directly on the support plateincludes stretching the dynamic release tape over the support plate.

The method includes irradiating the dynamic release structure of thediscrete assembly through the support plate to release the discretecomponent from the dynamic release tape.

In an aspect, a method includes dicing a wafer adhered to a dicing tapeto form discrete components; transferring the discrete components fromthe dicing tape to a dynamic release tape to form a discrete componentassembly, including: a flexible support layer, and a dynamic releasestructure disposed on the flexible support layer; and positioning thediscrete component assembly in a component transfer system such that atleast a portion of the dynamic release tape is freestanding.

Embodiments can include one or more of the following features.

The method includes irradiating the freestanding dynamic release tape torelease the discrete component from the dynamic release tape.

The dynamic release structure of the dynamic release tape includesmultiple layers. The dynamic release structure includes an active layerstructure and a component adhesion layer, in which adhering the wafer tothe dynamic release tape includes adhering the wafer to the componentadhesion layer.

In an aspect, a method includes adhering a wafer to a dynamic releasetape including: a freestanding flexible support layer, and a dynamicrelease structure disposed on the flexible support layer; and dicing theadhered wafer to form discrete components adhered to the dynamic releasetape.

Embodiments can include one or more of the following features.

Adhering the wafer to the dynamic release tape includes adhering thewafer to a component adhesion layer of the dynamic release structure.

The dynamic release structure of the dynamic release tape includesmultiple layers. The dynamic release structure includes an active layerstructure and a component adhesion layer, in which adhering the wafer tothe dynamic release tape includes adhering the wafer to the componentadhesion layer.

In an aspect, a method includes adhering a wafer to a dynamic releasetape including: a flexible support layer, and a dynamic releasestructure disposed on the flexible support layer; dicing the adheredwafer to form discrete components adhered to the dynamic release tape,in which the discrete components adhered to the dynamic release tapeinclude a discrete component assembly; and positioning the flexiblesupport layer of the discrete component assembly directly on a supportplate of a component transfer system.

Embodiments can include one or more of the following features.

Positioning the flexible support layer directly on the support plateincludes attaching the flexible support layer of the dynamic releasetape directly to the support plate.

Positioning the flexible support layer directly on the support plateincludes holding the discrete component assembly on the support plate byapplication of a suction.

Positioning the flexible support layer on the support plate includesstretching the dynamic release tape over the support plate.

The method includes irradiating the dynamic release structure of thediscrete assembly through the support plate to release the discretecomponent from the dynamic release tape.

The dynamic release structure of the dynamic release tape includesmultiple layers. The dynamic release structure includes an active layerstructure and a component adhesion layer, in which adhering the wafer tothe dynamic release tape includes adhering the wafer to the componentadhesion layer.

In an aspect, a method includes adhering a wafer to a dynamic releasetape including: a flexible support layer, and a dynamic releasestructure disposed on the flexible support layer; dicing the adheredwafer to form discrete components adhered to the dynamic release tape,in which the discrete components adhered to the dynamic release tapeinclude a discrete component assembly; and positioning the discretecomponent assembly in a component transfer system such that at least aportion of the dynamic release tape is freestanding.

Embodiments can include one or more of the following features.

The method includes irradiating the freestanding dynamic release tape torelease the discrete component from the dynamic release tape.

The dynamic release structure of the dynamic release tape includesmultiple layers. The dynamic release structure includes an active layerstructure and a component adhesion layer, in which adhering the wafer tothe dynamic release tape includes adhering the wafer to the componentadhesion layer.

In an aspect, an apparatus includes a dynamic release tape including: aflexible support layer; and a dynamic release structure disposed on theflexible support layer.

Embodiments can include one or more of the following features.

The dynamic release tape is sufficiently rigid to enable laser transferof a discrete component from the dynamic release tape.

The dynamic release tape is sufficiently rigid to maintain asubstantially planar configuration during laser transfer of a discretecomponent from the dynamic release tape. The flexible support layerincludes a polymer. The dynamic release structure includes multiplelayers. The dynamic release structure includes an absorbing and adhesionlayer disposed on the flexible support layer and configured to adhere tothe flexible support layer and to generate a gas responsive toirradiation by light; and an active layer disposed on the absorbing andadhesion layer. The active layer includes a blistering layer configuredto respond mechanically to the generation of gas by the absorbing andadhesion layer. The dynamic release structure includes: an adhesionlayer disposed on the flexible support layer and configured to adhere tothe flexible support layer; and an active layer structure disposed onthe adhesion layer. The active layer structure includes an absorbing andblistering layer configured to generate a gas responsive to irradiationby light, and to respond mechanically to the gas generation. The activelayer structure includes: an absorbing layer disposed on the adhesionlayer and configured to generate a gas responsive to irradiation bylight; and a blistering layer configured to respond mechanically to thegeneration of gas by the absorbing layer. One of the layers of thedynamic release structure includes a component adhesion layer. Anadhesion of the component adhesion layer is responsive to application ofa stimulus.

The tape is stretchable.

The flexible support layer is transparent to ultraviolet light.

The apparatus includes a discrete component adhered to the dynamicrelease structure. The discrete component includes a light emittingdiode (LED).

In an aspect, a method includes forming a dynamic release structure on aflexible support layer to form a dynamic release tape.

Embodiments can include one or more of the following features.

Forming the dynamic release structure includes forming multiple layerson the flexible support layer. Forming the dynamic release structureincludes: forming an absorbing and adhesion layer on the flexiblesupport layer, the absorbing and adhesion layer being configured toadhere to the flexible support layer and to generate a gas responsive toirradiation by light; and forming an active layer on the absorbing andadhesion layer. The active layer includes a blistering layer configuredto respond mechanically to the generation of gas by the absorbing andadhesion layer. Forming the dynamic release structure includes: formingan adhesion layer on the flexible support layer, the adhesion layerbeing configured to adhere to the flexible support layer; and forming anactive layer structure on the adhesion layer. The active layer structureincludes an absorbing and blistering layer configured to generate a gasresponsive to irradiation by light, and to respond mechanically to thegas generation. Forming the active layer structure includes: forming anabsorbing layer on the adhesion layer, the absorbing layer beingconfigured to generate a gas responsive to irradiation by light; andforming a blistering layer on the absorbing layer, the blistering layerbeing configured to respond mechanically to the generation of gas by theabsorbing layer.

In an aspect, a dynamic release apparatus includes a flexible supportlayer; and a dynamic release structure disposed on the flexible supportlayer, the dynamic release structure including: an adhesion layerdisposed on the flexible support layer and configured to adhere to theflexible support layer; and an active layer structure disposed on theadhesion layer.

Embodiments can include one or more of the following features.

The active layer structure includes an absorbing and blistering layerconfigured to generate a gas responsive to irradiation by light, and torespond mechanically to the gas generation.

The active layer structure includes: an absorbing layer disposed on theadhesion layer and configured to generate a gas responsive toirradiation by light; and a blistering layer configured to respondmechanically to the generation of gas by the absorbing layer.

The dynamic release structure includes a component adhesion layer.

In an aspect, a method includes positioning a discrete componentassembly on a support fixture of a component transfer system, thediscrete component assembly including a dynamic release tape including aflexible support layer, and a dynamic release structure disposed on theflexible support layer, and a discrete component adhered to the dynamicrelease tape. The method includes irradiating the dynamic releasestructure to release the discrete component from the dynamic releasetape.

In an aspect, a discrete component transfer system includes a lightsource; and a discrete component support fixture including a supportframe; a support plate positioned on the support frame, the supportplate being transparent to light emitted by the light source; and anoptical element disposed between the light source and the support frame.

In an aspect, a discrete component transfer system includes a lightsource; a discrete component support fixture; and a discrete componentassembly disposed on the discrete component support fixture. Thediscrete component assembly includes a dynamic release tape comprising aflexible support layer and a dynamic release structure disposed on theflexible support layer, and a discrete component adhered to the dynamicrelease tape. The discrete component transfer system includes an opticalelement disposed between the light source and the discrete componentassembly.

In an aspect, a method includes dicing a wafer adhered to a dicing tapeto form discrete components; and transferring the discrete componentsfrom the dicing tape to a dynamic release tape to form a discretecomponent assembly, including a flexible support layer, and a dynamicrelease structure disposed on the flexible support layer.

In an aspect, a method includes adhering a wafer to a dynamic releasetape including a flexible support layer, and a dynamic release structuredisposed on the flexible support layer; and dicing the adhered wafer toform discrete components adhered to the dynamic release tape.

In an aspect, an apparatus includes a dynamic release tape including aflexible support layer; and a dynamic release structure disposed on theflexible support layer.

In an aspect, a method includes forming a dynamic release structure on aflexible support layer to form a dynamic release tape.

In an aspect, a dynamic release apparatus includes a support layer; anda dynamic release structure disposed on the support layer, the dynamicrelease structure including an adhesion layer disposed on the supportlayer and configured to adhere to the support layer; and an active layerstructure disposed on the adhesion layer.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are diagrams of a laser-assisted transfer process.

FIGS. 2A and 2B are diagrams of a dynamic release tape with a supportfixture.

FIG. 3 is a diagram of a dynamic release tape with a support fixture.

FIGS. 4 and 5 are diagrams of systems for laser-assisted transfer ofdiscrete components.

FIGS. 6 and 7 are process diagrams.

FIGS. 8A-8C are diagrams of multilayer dynamic release tapes mounted onsupport plates.

FIGS. 9A-9C are diagrams of multilayer dynamic release structures.

FIG. 10 is a diagram of a dynamic release tape with a support fixture.

DETAILED DESCRIPTION

We describe here an approach to laser-assisted transfer of discretecomponents from a thin, flexible dynamic release tape positioned on asupport plate of a component transfer system. The dynamic release tapeincludes a multilayer dynamic release structure disposed on a supportlayer, such as a backing. Each layer of the dynamic release structurecan be designed specifically to target one or more functionalities ofthe dynamic release structure, such as adhesion, optical properties, ormechanical properties. We also describe laser-assisted transfer ofdiscrete components from a dynamic release tape that is disposed on acarrier substrate.

FIGS. 1A and 1B depict a laser-assisted transfer process forhigh-throughput, low-cost contactless assembly of discrete components102 onto rigid or flexible substrates. The term discrete componentrefers generally to, for example, any unit that is to become part of aproduct or electronic device, for example, electronic,electromechanical, photovoltaic, photonic, or optoelectronic components,modules, or systems, for example any semiconductor material having acircuit formed on a portion of the semiconducting material. In someexamples, the discrete components can be light emitting diodes (LEDs).The discrete components can be ultra-thin, meaning having a maximumthickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less,20 μm or less, 10 μm or less, or 5 μm or less. The discrete componentscan be ultra-small, meaning having a maximum length or width dimensionless than or equal to 300 μm per side, 100 μm per side, 50 μm per side,20 μm per side, or 5 μm per side. The discrete components can be bothultra-thin and ultra-small.

FIGS. 1A and 1B show a portion of a support fixture 100 of a componenttransfer system for laser-assisted transfer of discrete components 102.The support fixture 100 holds a flexible discrete component assembly 108in position for the laser-assisted transfer process. The support fixture(described in more detail below) can include a rigid support plate 106mounted on a frame (not shown: described in more detail below). Theframe provides stability to the rigid support plate 106. In someexamples, the frame can be manipulated, e.g., for alignment purposes.The discrete component assembly 108 can be attached to the support plate106 by suction force, tensile stress, or in another way, as described inmore detail below. The positioning of the discrete component assembly108 on the support plate 106 is non-permanent, e.g., such that thediscrete component assembly 108 can be removed from the support plate106 after the laser-assisted transfer process is completed withoutdamaging the support plate 106. The non-permanent attachment of thediscrete component assembly 108 on the support plate 106 makes thesupport plate 106 available for multiple transfer processes involvingmultiple discrete component assemblies 108.

The discrete component assembly 108 includes a dynamic release tape 110mounted on a wafer ring (not shown), with a discrete component 102adhered to the dynamic release tape 110. Although we show only a singlediscrete component 102 here, multiple discrete components 102 can alsobe adhered to the dynamic release tape 110 and transferred by thecomponent transfer system. A dynamic release tape (e.g., the tape 110)is a tape that includes a flexible support layer 112 and a dynamicrelease structure 114 disposed on the flexible support layer 112. A tapeis a thin, flexible material composed of one or more layers. Theflexible support layer 112 contacts the support plate 106 of the supportfixture 100, and the discrete component 102 is adhered to the dynamicrelease structure 114. The dynamic release structure 114 can be amulti-layer structure, such as a structure having two, three, four, ormore than four layers, as discussed in greater detail below.

Referring also to FIG. 1B, in the laser-assisted transfer process, aback side of the support plate 106 is irradiated with radiation 116,such as light, e.g., a laser beam. The support plate 106 and theflexible support layer 112 of the dynamic release tape 110 are bothtransparent to the wavelength of the radiation 116 (e.g., the laserenergy). An element that is transparent to a given wavelength is anelement for which at least some radiation of the given wavelength passesthrough the element. The radiation 116 passes through the support plate106 and the flexible support layer 112 of the dynamic release tape 110and is incident on an area of the dynamic release structure 114, causingablation of a partial thickness of the dynamic release structure 114 inthe area on which the radiation 116 is incident (which we refer to asthe irradiated area). The ablation generates confined gas, whichexpands, generating a stress in the dynamic release structure 114. Thestress causes at least some of the material of the dynamic releasestructure 114 to deform, forming a blister 118. The blister 118 exerts amechanical force on the discrete component 102. When the mechanicalforce exerted by the blister 118 is sufficient to overcome the adhesionbetween the discrete component 102 and the dynamic release structure114, the mechanical force exerted by the blister 118 (in combinationwith gravity) propels the discrete component away from the support plate106 (e.g., in a downward direction) for transfer to a target substrate130.

The target substrate 130 can be positioned in close proximity to thediscrete component 102, e.g., at a distance of between about 5 μm andabout 300 μm. The use of a rigid support plate 106 to support thetape-based discrete component assembly 108 helps to maintain aconsistent separation between the discrete components 102 of thediscrete component assembly 108 and the target substrate 130, e.g., bypreventing sagging or other structural variations in the tape 110. Insome examples, the support plate 106 can be provided with a high degreeof surface flatness. For instance, the support plate 106 can be machinedto high precision.

In some laser-assisted transfer processes, discrete components areadhered to a rigid, transparent carrier substrate by a dynamic releasestructure. The carrier substrate with adhered discrete components isprovided to a component transfer system for laser-assisted transfer ofthe discrete components. The component transfer systems described here,in which a rigid, transparent support plate is incorporated into thecomponent transfer system itself, enables discrete components to betransferred from a tape rather than from a rigid carrier substrate,reducing the cost (e.g., in materials, fabrication, transportation,etc.) of end-to-end discrete component transfer processes. For instance,rigid carrier substrates can be significantly more expensive thandynamic release tapes. Furthermore, dynamic release tapes aredisposable, eliminating the need for and associated cost of refurbishingthe rigid carrier substrates.

In some examples, the dynamic release tapes used in discrete componenttransfer processes are freestanding tapes. Freestanding tapes are tapesthat are not attached to a rigid substrate. In some examples,freestanding tapes can be positioned on, but not attached to, a rigidsubstrate for one or more steps of a discrete component transferprocess. For instance, a freestanding tape can be positioned on a rigidsubstrate during attachment of discrete components to the tape, duringintroduction into a component transfer system, or during laser-assistedtransfer of discrete components.

In some examples, the dynamic release tapes used in discrete componenttransfer processes are not freestanding tapes, but instead are attachedto a rigid substrate during attachment of discrete components to thetape, during introduction into a component transfer system, and duringlaser-assisted transfer of discrete components.

Further description of laser-assisted transfer processes can be found inU.S. Patent Publication No. US 2014/0238592, the contents of which areincorporated here by reference in their entirety.

FIGS. 2A and 2B show cutaway views of an example support fixture 200including a support plate 206 for positioning a discrete componentassembly 208 for a laser-assisted transfer process. The support plate206 is a rigid plate that is transparent to the wavelength of theradiation used for the laser transfer process, e.g., ultraviolet (UV)light. For instance, the support plate 206 can be a glass plate, aquartz plate, or a plate of another material. The support plate 206 ismounted on a frame 220 of the support fixture. In some examples, such asis shown in FIGS. 2A and 2B, the frame 220 has an opening 221 to allowradiation to reach the support plate 206. In some examples, the frame220 can lack the opening and can be transparent to the wavelength of theradiation such that the radiation is transmitted through the frame 220.

The discrete component assembly 208 includes a freestanding dynamicrelease tape 210 mounted on a wafer ring 222, with discrete components102 adhered to the dynamic release tape 210. For instance, the dynamicrelease tape 210 can be stretched on the wafer ring 222. In the exampleof FIGS. 2A-2B, the dynamic release tape 210 includes a flexible supportlayer 212 with a multilayer dynamic release structure 214 disposed onthe flexible support layer 212. The example multilayer dynamic releasestructure 214 includes multiple sublayers 224 a, 224 b that haveadhesion, radiation absorption, and blistering functionality; and acomponent adhesive layer 226 that adheres to the discrete component 102.Multilayer dynamic release structures 214 are discussed in greaterdetail below.

Referring specifically to FIG. 2B, to position the discrete componentassembly 208 on the support plate 206 of the component transfer system,the wafer ring 222 is brought into contact with the frame 220 and theback side of the flexible support layer 212 of the dynamic release tape210 is brought into contact with the support plate 206. When positioned,a top surface 223 of the wafer ring 222 is substantially level with(e.g., aligned with) a top surface 207 of the support plate 206, suchthat the dynamic release tape 210 is substantially flat across itsentire lateral extent.

A suction is applied through an air flow channel 228, e.g., by a suctionsource of the component transfer system to hold the dynamic release tape210 against the support plate 206. For instance, the air flow channel228 can be defined through a thickness of the frame 220 of the componenttransfer system (as shown) or through a thickness of the support plate206, or both. Application of a suction pulls the dynamic release tape210 firmly against the support plate 206, e.g., such that the dynamicrelease structure 214 is substantially flat.

Referring to FIG. 10, in some examples, a support fixture 150 includes aframe 170 but no support plate (e.g., no support plate 206 as shown inFIGS. 2A and 2B). The wafer ring 222 of the discrete component assembly208 is mounted on the frame 170 of the support fixture 150, and thedynamic release tape 210 remains otherwise freestanding for thelaser-assisted transfer process. Laser-assisted transfer directly fromthe freestanding dynamic release tape 210 can be carried out when thedynamic release tape 210 is sufficiently rigid, such as rigid enough tomaintain a substantially planar configuration throughout the duration ofthe laser-assisted transfer process. For instance, the dynamic releasetape 210 can be sufficiently rigid such that when the discrete componentassembly 208 is mounted on the frame 170, the maximum deviation of thedynamic release tape 210 in a direction z perpendicular to the plane ofthe tape 210 is less than a threshold amount, e.g., less than 20 μm,less than 10 μm, or less than 5 μm.

FIG. 3 shows a cutaway view of an example support fixture 300 includinga support plate 306 for positioning the discrete component assembly 208for a laser-assisted transfer process. The support plate 306 is a rigidplate that is transparent to the wavelength of the radiation used forthe laser transfer process, e.g., UV light. The support plate 306 ismounted on a frame 320 of the support fixture 300. The frame 320 has anopening 321 to allow radiation to reach the support plate 306. In someexamples, the frame 320 can be transparent to the wavelength of theradiation such that the radiation is transmitted through the frame 320.

In the example of FIG. 3, when the discrete component assembly 208 ispositioned on the support fixture 300, the top surface 223 of the waferring 222 is at a lower level than (e.g., misaligned from) a top surface307 of the support plate 306. For instance, the frame 320 of the supportfixture 300 can be misaligned from the top surface of the support plate306 by an amount such that when the discrete component assembly 208 ispositioned on the support plate, there is still a misalignment betweenthe support plate 306 and the wafer ring 222. This misalignmentintroduces a tensile stress in the dynamic release tape 210 that holdsthe dynamic release tape 210 against the support plate 306, e.g., suchthat the dynamic release structure 214 is substantially flat. The amountof tensile stress, and hence the force with which the dynamic releasetape 210 is held against the support plate 306, can be controlled byvarying the height difference between the top surface 223 of the waferring 222 and the top surface 307 of the support plate 306.

In some examples, other approaches can be employed to position thedynamic release tape 210 on a support plate of a component transfersystem, such as by using approaches involving magnetic forces, staticelectricity, mechanical fixation, or other approaches.

FIG. 4 shows an example of a component transfer system 450. Thecomponent transfer system 450 includes a support fixture 400 having asupport plate 406 mounted on a frame 420. The support fixture 400 ispositioned such that a discrete component assembly 408 is held on thesupport plate 406. The discrete component assembly 408 includes adynamic release tape 410 with an attached discrete component 102, withthe dynamic release tape 410 mounted on a wafer ring 422, e.g.,stretched on the wafer ring 422. For instance, the wafer ring 422 ispositioned on the frame 420 and the stretched dynamic release tape 410is held against the support plate 406. The discrete component assembly408 can be irradiated with radiation (e.g., light, such as UV light)from a light source 452, e.g., a laser. Light from the light source 452can be manipulated, e.g., focused, by an optical element 454, such as alens, disposed between the light source 452 and the support plate 406.The frame 420 has an opening 421 to allow radiation from the lightsource 452 to reach the support plate 406. A substrate holder 432 holdsa target substrate 430 onto which the discrete components aretransferred by the laser-assisted transfer process.

In some examples, such as when the support fixture 400 is configured tohold a discrete component assembly against the support plate 406 byapplication of a suction, the component transfer system 450 can includea suction source 434 that is fluidically connected (e.g., by tubing, notshown) to one or more air flow channels (not shown) in the support plate406 or the frame 420.

FIG. 5 shows an example of a component transfer system 550 having alight source 552 and an optical element 554. The component transfersystem 550 includes a support fixture 500 including a frame 520. Nosupport plate is mounted on the frame 520. A discrete component assembly508 is held on the frame 520, the discrete component assembly 508including a dynamic release tape 510 mounted on a wafer ring 522. Inthis configuration, the wafer ring 522 of the discrete componentassembly 508 is positioned on the frame 520 and the dynamic release tape510 is a freestanding tape (meaning a tape that is not supported by arigid substrate or support plate) during the laser-assisted transferprocess. The discrete components 102 are transferred onto a targetsubstrate 530 held by a substrate holder 532.

In some examples, the component transfer systems 450, 550 can beconfigured for parallel transfer of multiple discrete components, or canbe configured to have a single-component transfer mode and amultiple-component transfer mode, as described in more detail in WO2018/231344, filed on Apr. 25, 2018, the contents of which areincorporated here by reference in their entirety.

Referring to FIG. 6, in some examples, discrete components 602 can betransferred to a dynamic release tape 610 after a dicing process. Awafer 630 including one or more electronic components (e.g., integratedcircuits) is adhered (650) to a dicing tape 632 and diced (652) to formdiscrete components 602, e.g., using standard wafer processingtechniques for wafer dicing. For instance, the dicing tape 632 can bemounted on a wafer ring. In some examples, the dicing process caninclude stretching the dicing tape laterally to separate the discretecomponents 602, e.g., by expanding the dicing tape 632 onto the waferring.

The discrete components 602 are transferred (654) onto a dynamic releasetape 610 and the dicing tape 632 is removed (656), leaving the discretecomponents 602 adhered to the dynamic release tape 610. For instance,the discrete components 602 can be adhered to a component adhesion layerof the dynamic release tape 610 (discussed below). The dynamic releasetape 610 with the adhered discrete components 602 is attached (658) to atransparent, rigid support plate 606 of a component transfer system forlaser-assisted transfer of the discrete components 602 onto a targetsubstrate. For instance, a flexible support layer of the dynamic releasetape 610 is attached to the support plate, e.g., by suction, tensilestress, or in another way.

Referring to FIG. 7, in some examples, discrete components 702 can bediced directly on a dynamic release tape 710. A wafer 730 including oneor more semiconductor dies (e.g., integrated circuits) is adhered (750)to the dynamic release tape 710, e.g., to a component adhesion layer ofthe dynamic release tape 710. The adhered wafer 730 is diced (752) toform discrete components 702, e.g., using standard wafer processingtechniques for wafer dicing. For instance, the dynamic release tape 710can be mounted on a wafer ring. In some examples, the dynamic releaselayer tape 710 is stretchable and the dicing process can includestretching the dynamic release layer tape 710 laterally to separate thediscrete components 702, e.g., by expanding the dynamic release tape onthe wafer ring.

The dynamic release layer tape 710 with the adhered discrete components702 is attached (754) to a transparent, rigid support plate 706 of acomponent transfer system for laser-assisted transfer of the discretecomponents 702 onto a target substrate. For instance, a flexible supportlayer of the dynamic release tape 710 is attached to the support plate,e.g., by suction, tensile stress, or in another way.

In the process of FIG. 7, the step of transferring the diced discretecomponents 702 from a dicing tape to the dynamic release layer tape isnot included, making the process of FIG. 7 streamlined and efficient.

Referring to FIGS. 8A-8C, dynamic release layer tapes 800, 820, 840 canbe multi-layer tapes having a flexible support layer 812 and amultilayer dynamic release structure 814, 834, 854, respectively,disposed on the flexible support layer 812. Discrete components 802 canbe adhered to the dynamic release structures 814, 834, 854 by acomponent adhesion layer 808 that forms part of each multilayer dynamicrelease structure 814, 834, 854. The multilayer dynamic releasestructures 814, 834, 854 can be formed of varying numbers of layershaving various compositions and functions. As shown in FIGS. 8A-8C, thedynamic release layer tapes 800, 820, 840 can be positioned on a rigidsupport, such as a support plate 806 of a component transfer system,that is transparent to the radiation used for laser-assisted transferprocesses. In some examples, the dynamic release layer tapes 800, 820,840 can be used in other environments, such as attached to a wafer ring,or otherwise used.

The flexible support layer 812 is a thin, flexible film that istransparent to the radiation used for the laser-assisted transferprocesses, e.g., transparent to UV light. For instance, the flexiblesupport layer 812 can be a polymer film, such as polyvinylchloride(PVC), polyethylene terephthalate (PET) or poly(methyl methacrylate)(PMMA). The flexible support layer 812 is sufficiently thin and flexiblesuch that the dynamic release layer tape 800, 820, 840 can bemanipulated, e.g., rolled, bent, or stretched, without breaking thetape. The presence of the flexible support layer 812 allows the dynamicrelease layer tapes 800, 820, 840 to be freestanding tapes, e.g., withsufficient mechanical integrity to be handled without being attached toa rigid substrate.

Referring specifically to FIG. 8A, in some examples, the dynamic releasestructure 814 of the dynamic release layer tape 800 can be a three-layerstructure having an absorbing and adhesion layer 804 disposed on theflexible support layer 812 and an active layer 805, such as a blisteringlayer (as shown in FIG. 8A), disposed on the absorbing and adhesionlayer 804. The component adhesion layer 808 is disposed on the activelayer 805.

The absorbing and adhesion layer 804 has a dual functionality: bondingof the active layer 805 to the flexible support layer 812, andabsorption of energy from the irradiation during a laser-assistedtransfer process. For instance, the absorbing and adhesion layer 804 canabsorb at least 90%, at least 95%, at least 98%, or at least 99% of theenergy that is incident on the absorbing and adhesion layer 804, e.g.,to prevent the radiation from reaching and potentially damaging thediscrete components adhered to the tape 800.

Energy absorption by the absorption and adhesion layer 804 results inablation of the layer, generating a gas. The generated gas induces amechanical response in the adjacent active layer 805. For instance, asshown in FIG. 8A, the active layer 805 can be a blistering layer inwhich a blister is formed (e.g., as shown in FIG. 1B) responsive to thegas generation.

Referring to FIG. 8B, in some examples, the dynamic release structure834 of the dynamic release layer tape 820 can be a three-layer structurehaving an adhesion layer 824 disposed on the flexible support layer 812and an active layer 826, such as an absorbing and blistering layer (asshown in FIG. 8B), disposed on the adhesion layer 824. The componentadhesion layer 808 is disposed on the active layer 826.

The adhesion layer 824 exhibits an adhesion sufficient to bond theactive layer 826 to the flexible support layer 812. In the example ofFIG. 8B, the active layer 826 is an absorbing and blistering layer. Theactive layer 826 absorbs energy from the irradiation during alaser-assisted transfer process, generating a gas which induces amechanical response, such as formation of a blister, in the active layer826. For instance, the active layer 826 can absorb at least 90%, atleast 95%, at least 98%, or at least 99% of the incident energy.

Referring to FIG. 8C, in some examples, the dynamic release structure854 of the dynamic release layer tape 840 can be a four-layer structurehaving an adhesion layer 844 disposed on the flexible support layer 812and an active layer structure 846 disposed on the adhesion layer 844.The component adhesion layer 808 is disposed on the active layerstructure 846.

The adhesion layer 844 exhibits an adhesion sufficient to bond theactive layer structure 846 to the flexible support layer 812. The activelayer structure 846 includes two layers, an absorbing layer 848 and ablistering layer 850. The absorbing layer 848 absorbs energy from theirradiation during a laser-assisted transfer process, generating a gas.For instance, the absorbing layer 848 can absorb at least 90%, at least95%, at least 98%, or at least 99% of the incident energy. Thegeneration of gas induces a mechanical response, such as formation of ablister, in the blistering layer 850.

Dynamic release structures (e.g., the dynamic release structures 814,834, 854) have multiple functionalities, e.g., adhesion to the flexiblesupport layer, internal adhesion between layers, absorption of incidentradiation, and mechanical response (e.g., blistering). The multilayernature of the dynamic release structures 814, 834, 854 can allow foreach layer to be designed specifically to achieve one or more of thesefunctionalities.

In the example of FIG. 8A, the absorbing and adhesion layer 804 can bedesigned to adhere to the support layer 812, to absorb incidentradiation, and to generate a sufficient amount of gas to cause formationof a blister in the active layer 805. In some examples, the absorbingand adhesion layer 804 can be designed to promote internal adhesion,e.g., to adhere to the active layer 805 with sufficient adhesion to atleast partially avoid delamination of the blister, which could result ina large diameter blister with the potential to impact the transfer ofdiscrete components in neighboring positions, e.g., discrete componentsnot intended for transfer. In the design of the absorbing and adhesionlayer 804, the optical and adhesion properties of the layer can be thefocus of the design, while the mechanical properties of the layer, suchas its strength or modulus, can be secondary to the design. In contrast,the thickness and composition of the active layer 805 can be designedwith a focus on mechanical properties, e.g., to achieve a desiredblistering response, while the optical and adhesion properties of thelayer can be secondary. In some examples, the active layer 805 can bedesigned to have mechanical properties that allow for formation ofblisters of a target size and that do not rupture, and to prevent any ofthe gas generated by the absorbing and adhesion layer 804 from escapingfrom the dynamic release structure 814. For instance, the target sizefor a blister can be a height-to-diameter ratio of about one and a basediameter no greater than about three times the diameter of theirradiation beam (e.g., a laser beam). In a specific example, the activelayer 805 can be a polymer film, e.g., a film of PET or a polyimide,with a thickness of between about 2 μm and about 5 μm.

Furthermore, in the dynamic release structure 814 of FIG. 8A, the activelayer 805 does not itself absorb energy, and so is notpartially-ablated. Rather, the ablation occurs in the adjacent absorbingand adhesion layer 804. Because no ablation occurs in the active layer805, the thickness of the active layer 805 is not affected by the amountof laser energy delivered to the blister location, meaning that theactive layer 805 is not thinned by the irradiation. This separation ofablation and blister formation into two distinct layers allows for theuse of higher pulse energies to create larger blisters.

In some examples, such as when the discrete components 802 aretransferred from a dicing tape (as in FIG. 6) or other source substrateto a dynamic release layer tape, or when a wafer is diced directly on adynamic release layer tape to form the discrete components 802, thecomponent adhesion layer 808 can be designed to have an adhesivestrength that is greater than the force that holds the discretecomponents 802 to their source substrate. In some examples, a relativelylow adhesion between the component adhesion layer 808 and the discretecomponents 802 can contribute to a high precision during thelaser-assisted transfer process. The component adhesion layer 808 can bedesigned to have an adhesive strength that is as low as possible whilestill being sufficient to keep the discrete components adhered to thedynamic release layer tape prior to the laser-assisted transfer process.In some examples, to satisfy these contradicting criteria of thecomponent adhesion layer 808 having both a high adhesive strength and alow adhesive strength, the component adhesion layer 808 can be designedto have an adhesive strength that can be modified by application of astimulus, such as UV light or heat. The initial strong adhesion of thecomponent adhesion layer 808 can facilitate a reliable transfer of thediscrete components 802 from their source substrate to the dynamicrelease layer tape. The initial adhesion of the component adhesion layer808 can also support a wafer during a dicing process to form thediscrete components. Before the laser-assisted transfer process, astimulus can be applied, reducing the adhesion between the componentadhesion layer 808 and the discrete components 802 to a level that cancontribute to precise component placement during the transfer.

Referring to FIGS. 9A-9C, in some examples, a multilayer dynamic releasestructure 914, 934, 954 can be applied to a rigid carrier substrate 910,such a glass carrier substrate. Discrete components 902 can be adheredto the rigid carrier substrate 910 by the dynamic release structures914, 934, 954 to form discrete component assemblies 900, 920, 940. Thediscrete components 902 can be transferred onto a target substrate by alaser-assisted transfer process directly from the rigid carriersubstrate 910.

The dynamic release structures can be provided as freestanding tapes andapplied onto carrier substrate 910 as tapes, e.g., by roll coating orother ways of tape application. In some examples, dynamic releasestructures can be spin coated onto carrier substrates. The applicationof a dynamic release structure in tape form onto a carrier substrate canhave advantages over spin coating, such as reduced cost, less laborintensive processing, and more efficient application.

The dynamic release structures 914, 934, 954 provided in tape form forapplication to a rigid carrier substrate 910 can be multilayerstructures such as those described above with respect to FIGS. 8A-8C.

Referring specifically to FIG. 9A, in some examples, the dynamic releasestructure 914 can be a three-layer structure having an absorbing andadhesion layer 904 that adheres to the rigid carrier substrate 910. Anactive layer 906, such as a blistering layer (as shown in FIG. 9A), isdisposed on the absorbing and adhesion layer 904. A component adhesionlayer 908 is disposed on the active layer 906.

The absorbing and adhesion layer 904 has a dual functionality: bondingof the active layer 906 to the rigid carrier substrate 910, andabsorption of energy from the irradiation during a laser-assistedtransfer process. Energy absorption by the absorption and adhesion layer904 results in ablation of the layer, generating a gas. The generatedgas induces a mechanical response in the adjacent active layer 906. Forinstance, as shown in FIG. 9A, the active layer 906 can be a blisteringlayer in which a blister is formed responsive to the gas generation,effecting transfer of the discrete components 902.

Referring to FIG. 9B, in some examples, the dynamic release structure934 can be a three-layer structure having an adhesion layer 924 thatadheres to the rigid carrier substrate 910 and an active layer 926, suchas an absorbing and blistering layer (as shown in FIG. 9B), disposed onthe adhesion layer 924. The component adhesion layer 908 is disposed onthe active layer 926. The adhesion layer 924 exhibits an adhesionsufficient to adhere to the carrier substrate 910. In the example ofFIG. 9B, the active layer 926 is an absorbing and blistering layer thatabsorbs energy from the irradiation during a laser-assisted transferprocess, generating a gas which induces a mechanical response, such asformation of a blister, in the active layer 926.

Referring to FIG. 9C, in some examples, the dynamic release structure954 can be a four-layer structure having an adhesion layer 944 thatadheres to the rigid carrier substrate 910 and an active layer structure946 disposed on the adhesion layer 944. The component adhesion layer 908is disposed on the active layer structure 946. The active layerstructure 946 includes two layers, an absorbing layer 948 and ablistering layer 950. The absorbing layer 948 absorbs energy from theirradiation during a laser-assisted transfer process, generating a gas.The generation of gas induces a mechanical response, such as formationof a blister, in the blistering layer 950.

The individual layers of the multilayer dynamic release structures canbe designed to achieve desired functionalities, as described above withrespect to FIGS. 8A-8C. For instance, the adhesion layers 904, 924, 954that adhere to the carrier substrate 910 can be designed to have anadhesion to the carrier substrate that is low enough to allow for easyremoval, facilitating refurbishment of the carrier substrate aftercompletion of the laser transfer process.

A number of embodiments have been described. Nevertheless, it will beunderstood that various modifications may be made without departing fromthe spirit and scope of the invention. For example, some of the stepsdescribed above may be order independent, and thus can be performed inan order different from that described.

Other implementations are also within the scope of the following claims.

1-98. (canceled)
 99. A method comprising: positioning a discretecomponent assembly on a support fixture of a component transfer system,the discrete component assembly including (a) a dynamic release tapeincluding a flexible support layer and a dynamic release structuredisposed on the flexible support layer, and (b) a discrete componentadhered to the dynamic release tape; and irradiating the dynamic releasestructure to release the discrete component from the dynamic releasetape.
 100. The method of claim 99 in which at least a portion of theflexible support layer is free-standing when the discrete componentassembly is positioned on the support fixture.
 101. The method of claim99 in which positioning the discrete component assembly on the supportfixture includes positioning the flexible support layer of the dynamicrelease tape directly on a support plate of the support fixture. 102.The method of claim 99 in which positioning the discrete componentassembly on the support fixture includes mounting a wafer ring of thediscrete component assembly on a frame of the support fixture.
 103. Themethod of claim 99 further comprising adhering the discrete component tothe dynamic release tape.
 104. The method of claim 99 further comprisingadhering the discrete component to a component adhesion layer of thedynamic release structure.
 105. The method of claim 99 furthercomprising adhering a wafer including the discrete component to thedynamic release tape.
 106. The method of claim 105 in which adhering thewafer to the dynamic release tape includes adhering the wafer to acomponent adhesion layer of the dynamic release structure.
 107. Themethod of claim 99 in which positioning the discrete component assemblyon the support fixture includes attaching the dynamic release tape,including the discrete component, to a support plate of the supportfixture.
 108. The method of claim 107 in which positioning the discretecomponent assembly on the support plate includes holding the discretecomponent assembly on the support plate by application of a suction.109. The method of claim 99 in which irradiating the dynamic releasestructure includes irradiating the dynamic release structure with lightfrom a light source of the component transfer system.
 110. A discretecomponent transfer system comprising: a light source; a discretecomponent support fixture including (a) a support frame, and (b) asupport plate positioned on the support frame, the support plate beingtransparent to light emitted by the light source; and an optical elementdisposed between the light source and the support frame.
 111. Thediscrete component transfer system of claim 110 further comprising asuction source configured to apply a suction to an air flow channel ofthe discrete component support fixture to hold a flexible support layerof a discrete component assembly against the support plate, wherein thediscrete component assembly includes (a) a dynamic release tapeincluding the flexible support layer and a dynamic release structuredisposed on the flexible support layer, and (b) a discrete componentadhered to the dynamic release tape.
 112. The discrete componenttransfer system of claim 111 in which the air flow channel is formedthrough a thickness of the support frame.
 113. The discrete componenttransfer system of claim 111 in which the air flow channel is formedthrough a thickness of the support plate.
 114. The discrete componenttransfer system of claim 110 further comprising (a) a discrete componentassembly including (i) a dynamic release tape including a flexiblesupport layer, and (ii) a dynamic release structure disposed on theflexible support layer, and (b) a discrete component adhered to thedynamic release tape, wherein the flexible support layer of the dynamicrelease tape is positioned directly on the support plate and held inplace by suction through an air flow channel of the discrete componentsupport fixture.
 115. The discrete component transfer system of claim110 in which a top surface of the support plate is misaligned from a topsurface of the support frame by an amount sufficient to introduce atensile stress in a dynamic release tape held on the discrete componentsupport fixture.
 116. A discrete component transfer system comprising: alight source; a discrete component support fixture; a discrete componentassembly disposed on the discrete component support fixture, thediscrete component assembly including (a) a dynamic release tapeincluding a flexible support layer and a dynamic release structuredisposed on the flexible support layer, and (b) a discrete componentadhered to the dynamic release tape; and an optical element disposedbetween the light source and the discrete component assembly.
 117. Thediscrete component transfer system of claim 116 in which the dynamicrelease tape is freestanding when the discrete component assembly isdisposed on the discrete component support fixture.
 118. The discretecomponent transfer system of claim 116 in which the discrete componentassembly includes a wafer ring disposed on the discrete componentsupport fixture.